Zheng, Wen-Chun. Curing and thermal-stress analyses of a Flip-Chip-On-Board electronic package. Curing and thermal-stress analyses of a Flip-Chip-On-Board electronic package. Engineering, Electronics and Electrical. 2014-03-18
    https://indigo.uic.edu/articles/thesis/Curing_and_thermal-stress_analyses_of_a_Flip-Chip-On-Board_electronic_package_/10868561