Curing and thermal-stress analyses of a Flip-Chip-On-Board electronic package.
book
posted on 2025-05-30, 14:20 authored by Wen-Chun. ZhengCuring and thermal-stress analyses of a Flip-Chip-On-Board electronic package.
History
Degree Grantor
University of Illinois at Chicago.Degree Level
- Doctoral
Language
- en
Usage metrics
Categories
No categories selectedLicence
Exports
RefWorks
BibTeX
Ref. manager
Endnote
DataCite
NLM
DC