As electronic devices get smaller and faster, which requires them to perform at ever growing power inputs, they develop hot spots which are very difficult to cool. Novel wick-free vapor chambers developed in our lab (MNFTL) at UIC work as efficient heat spreaders that can effectively cool high-power electronic devices. Our vapor chambers often incorporate intricate microstructures with hierarchical roughness (as seen here, nanoneedles growing on micro-hills), that leads to manifold increase of surface area from which water can evaporate easily, thereby cooling down such devices and ensuring better device performance.
Funding
This exhibit competition is organized by the University of Illinois Chicago Graduate College and the University Library