Evaluation of Thermal Performance of a Wick-free  Vapor Chamber in Power Electronics Cooling

Pal, Anish; Mukhopadhyay, Arani; Megaridis, Constantine; Jafari Gukeh, Mohamad; Bao, Congbo; Mazumder, Sudip

doi:10.25417/uic.23633676.v1

Evaluation of Thermal Performance of a Wick-free Vapor Chamber in Power Electronics Cooling

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posted on 2023-09-05, 00:18 authored by Anish PalAnish Pal, Arani Mukhopadhyay, Constantine MegaridisConstantine Megaridis, Mohamad Jafari GukehMohamad Jafari Gukeh, Congbo BaoCongbo Bao, Sudip MazumderSudip Mazumder

The work describes the wickless vapor chamber with wettability patterning for power electronics cooling applications, thereby eliminating the problems of wicked vapor chamber.

Funding

US Office of Naval Research under award number N14- 20-1-2025 to the University of Nebraska, Lincoln and a subaward to the University of Illinois Chicago

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Keywords

Power Electronics Applications Electronics cooling wettability pattern vapor chamber condensation evaporation

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GPL-2.0

Evaluation of Thermal Performance of a Wick-free Vapor Chamber in Power Electronics Cooling

Funding

US Office of Naval Research under award number N14- 20-1-2025 to the University of Nebraska, Lincoln and a subaward to the University of Illinois Chicago

History

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