University of Illinois at Chicago
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ITHERM2023_Paper176_T2_Mukhopadhyay_Arani2.pdf (2.42 MB)

Evaluation of Thermal Performance of a Wick-free Vapor Chamber in Power Electronics Cooling

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The work describes the wickless vapor chamber with wettability patterning for power electronics cooling applications, thereby eliminating the problems of wicked vapor chamber.

Funding

US Office of Naval Research under award number N14- 20-1-2025 to the University of Nebraska, Lincoln and a subaward to the University of Illinois Chicago

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