University of Illinois Chicago
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Energy- and Reliability-Aware Design of High-Speed Global On-Chip Interconnects.

thesis
posted on 2025-05-30, 16:49 authored by Md Sajjad. Rahaman
Energy- and Reliability-Aware Design of High-Speed Global On-Chip Interconnects.

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Degree Grantor

University of Illinois at Chicago.

Degree Level

  • Doctoral

Language

  • es

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