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Energy- and Reliability-Aware Design of High-Speed Global On-Chip Interconnects.

thesis
posted on 2014-12-04, 00:00 authored by Md Sajjad. Rahaman
Energy- and Reliability-Aware Design of High-Speed Global On-Chip Interconnects.

History

Degree Grantor

University of Illinois at Chicago.

Degree Level

  • Doctoral

Language

  • es

Issue date

2014-12-04

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    Keywords

    Engineering, Computer.Engineering, Electronics and Electrical.

    Licence

    In Copyright

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