Energy- and Reliability-Aware Design of High-Speed Global On-Chip Interconnects.

thesis

posted on 2025-05-30, 16:49 authored by Md Sajjad. Rahaman

Energy- and Reliability-Aware Design of High-Speed Global On-Chip Interconnects.

History

Degree Grantor

University of Illinois at Chicago.

Degree Level

Doctoral

Language

es

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Keywords

Engineering, Computer.Engineering, Electronics and Electrical.

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Exports