Energy- and Reliability-Aware Design of High-Speed Global On-Chip Interconnects.
thesis
posted on 2025-05-30, 16:49 authored by Md Sajjad. RahamanEnergy- and Reliability-Aware Design of High-Speed Global On-Chip
Interconnects.
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Degree Grantor
University of Illinois at Chicago.Degree Level
- Doctoral
Language
- es
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