University of Illinois Chicago
Browse

RESIDUAL STRESS MEASUREMENT IN SILICON SHEET BY SHADOW MOIRE INTERFEROMETRY.

thesis
posted on 2025-05-30, 16:20 authored by YOUNG HA. KWON
RESIDUAL STRESS MEASUREMENT IN SILICON SHEET BY SHADOW MOIRE INTERFEROMETRY.

History

Degree Grantor

University of Illinois at Chicago.

Degree Level

  • Doctoral

Language

  • en

Usage metrics

    Categories

    No categories selected

    Keywords

    Engineering, Materials Science.

    Licence

    In Copyright

    Exports

    RefWorks
    BibTeX
    Ref. manager
    Endnote
    DataCite
    NLM
    DC